| 型号 Model | OFH-4100i2 | ||||||
| 适用Wafer尺寸 Applicable Wafer Size | 200mm, 300mm(SEMI Standard) | ||||||
| 抓持Wafer的方法 Wafer Holding Method | Vacuum Chuck | ||||||
| 材质 Materials | Body:White Annodized Aluminum | ||||||
| Suction Base:Black Annodized Aluminum | |||||||
|
缺陷检出功能
Defect Detection Function |
最小检出尺寸 Min. Detectable Size |
Crack:1.0mm(W)×0.2mm(D) | |||||
| Burr:1.0mm(W)×0.2mm(D) | |||||||
| Scratch, Particle, Flaking:0.2mm(W)×0.2mm(D) | |||||||
|
检查可能范围
Detectable Area |
3mm from wafer edge excluding the bevel surface | ||||||
|
Wafer位置最大错位值
Wafer Centering Tolerance |
±7.0mm or less | ||||||
| 校正时间(含检查时间) Cycle-time | Min. 6.0 sec | ||||||
|
动作范围
Operation Range |
X-axis | ±7.5mm | |||||
| Y-axis | 65mm | ||||||
| θ-axis | Continuous | ||||||
|
决定位置精度
Accuracy |
X-direction | ±0.1mm | |||||
| Y-direction | ±0.1mm | ||||||
| θ-direction | ±0.2° | ||||||
| 外部I/F Eternal I/F | Serial communication (RS-232C) | ||||||
| Parallel communication (Sequencer control) | |||||||
| 洁净度 Cleanliness | ISO Class 3 (ISO-14644) | ||||||
| 本体重量 Mass | 10.8kg | ||||||
| 必要设施 Facilities | 真空 Vacuum | -80kPaG or less, 10NL/min | |||||
| 电源 Power | 24±10% VDC, 1A(for Defect Detection Unit) | ||||||
| 设置环境 | 温度 Temperature | 15-25℃ | |||||
| 湿度 Humidity | 20-60% or less, No condensation | ||||||
苏公网安备 32058102001225号
